Lee’s responsibilities include connecting machines and putting cutting edge IoT technologies to work at APC to monitor production in real time, measure quality, and drive continuous improvement for manufacturing. He began working in the packaging industry in early 2010 and is an accomplished engineer with more than 13 years in professional experience to his name. He graduated with a BSc in Mechanical Engineering from Clarkson University, in Potsdam, New York in 2007. Throughout his career, he has been a keen proponent of a data-driven analytical approach to continuous improvement. Lee is a Six Sigma Black Belt.
Senior Process Engineer
American Packaging Corporation