The Civil Infrastructure Platform (CIP) Project hosted by the Linux Foundation announced the release of the Super Long Term Support (SLTS) Kernel.  The new kernel expands architectural support for the 64-bit Arm Cortex, which enables developers to use it in a variety of use cases, including building automation, machine learning and artificial intelligence.

The Industrial Internet Consortium (IIC), now incorporating OpenFog, announces the Security Maturity Model (SMM) Practitioner’s Guide, which provides actionable guidance enabling IoT stakeholders to assess and manage the security maturity of IoT systems.

Siemens to announce a new version of the powermanager power monitoring software, whereby power data can now be directly transferred into open, cloud-based IoT operating systems, such as MindSphere.

The Digital Manufacturing and Design Innovation Institute (DMDII) announced that the U.S. Department of Defense (DoD) has awarded $10 million in funding this year and is pledging at least $20 million more over the next five years to drive the digital future of manufacturing. 

Balena, fka resin.io, officially released the balenaFin, a carrier board designed for the Raspberry Pi Compute Module 3 & 3+. The announcement coincides with the launch of the v1.1 revision, featuring many improvements to their original v1.0 board.

Telit, a global enabler of Internet of Things (IoT) solutions, announced Telit OneEdge, a new initiative developed to help speed IoT deployments and reduce the time required to monetize the digitalization of businesses.

Hewlett Packard Enterprise (HPE) announced the HPE Edgeline EL8000 Converged Edge System to help communication service providers (CSP) capitalize on data-intensive, low-latency services for media delivery, connected mobility, and smart cities.

Mitsubishi Electric Corporation announced that it will extend its MELIPC series of industrial PCs for edge computing and control applications in the field of factory automation (FA) by introducing two new MI3000 units on February 28.