HP and Siemens Deepen Additive Manufacturing Alliance to Advance Digital Manufacturing

By Fabian Wanke

Acquisition or Partnership

HP and Siemens announced an expansion of their strategic alliance to help customers transform their businesses with industrial additive manufacturing (AM).  Siemens and HP will expand their integrated additive manufacturing solution, incorporating new systems and software innovations including overall product lifecycle management (PLM), AM factory optimization, industrial 3D printing and data intelligence, manufacturing execution, and performance analytics.  

The integration of HP's new Jet Fusion 5200 Series 3D printing solution with Siemens' Digital Enterprise offerings enables industrial companies to reportedly bring 3D printed parts to market faster, more cost-effectively, more sustainably, and at higher volumes than ever before.  The companies announced the expanded alliance at an event to celebrate the addition of a new Polymer Competency Center to the Siemens Additive Manufacturing Experience Center (AMEC) in Erlangen, Germany, where HP also unveiled its new industrial-performance HP Jet Fusion 5200 Series 3D printing solution.

The expanded additive manufacturing solution from Siemens and HP integrates hardware, software, data intelligence, and services to optimize the efficiency of the entire manufacturing process, from design and simulation through production planning, execution, quality, and control.  This integrated, closed-loop environment streamlines every phase of designing and 3D printing serialized parts - with greater scale, higher quality, and less waste.

The solution combines HP's 3D printing and 3D data platform, including its new HP Jet Fusion 5200 system, with Siemens Digital Industries Software including Siemens NX CAD/CAE, NX AM for HP Multi Jet Fusion software module with direct printer interface, undergoing certification by HP for its Jet Fusion 5200 Series to be available later this year, as well as Teamcenter for PLM, Tecnomatix Plant Simulation, Simatic IT for manufacturing execution, and MindSphere for performance analytics and Industrial IoT.  HP and Siemens will continue to align future technology roadmaps to ensure customers can capitalize on the ongoing digital manufacturing innovations from both companies.

The cooperation is coupled with the new Siemens Polymer Competency Center, which will be the focal point for the two companies to work jointly with automotive and industrial customers to create unique product designs, bring 3D printed parts to market faster, and set up digital factory environments that unleash the full potential of additive manufacturing.

HP, Siemens, and their customers will initially explore new applications in areas such as personalization, fluid dynamics optimization, and energy absorption, to name a few.

David Humphrey, ARC Advisory Group, commented, “The key word in this cooperation is digital workflow.  As with any manufacturing process, AM machines need to be tightly integrated into the flow of information, from design to manufacturing.  With Teamcenter as its data hub, Siemens’ offering of digital tools to integrate HP’s industrial 3D printers will help users create and manage the digital workflow to maximize their investment in the fascination and rapidly growing area of additive manufacturing."

Engage with ARC Advisory Group