Schneider Electric has introduced prefabricated power modules and power skids for AI data center deployments, with capacities from 2 MW to 2.5 MW.
Schneider Electric has introduced standardized Prefabricated Power Modules and Power Skids for hyperscale, neocloud, and colocation data centers. The systems are intended to provide modular electrical infrastructure for high-density AI and high-performance computing workloads.
The new range uses Schneider Electric’s Galaxy VXL UPS technology and is available in 2 MW, 2.25 MW, and 2.5 MW configurations. The company states that the modules are available in Europe, with North American availability planned later this year, followed by other international markets and Asia-Pacific.

Schneider Electric’s prefabricated power module for AI data centers
Power Infrastructure for AI Data Center Deployments
The power modules and skids are based on Schneider Electric reference designs developed with NVIDIA. These designs incorporate power-management and liquid-cooling controls for NVIDIA’s GB300 NVL72 platform.
The systems are intended for AI training clusters, high-performance computing environments, and other GPU-intensive workloads. Schneider Electric states that the standardized reference designs can support infrastructure deployment timelines of as little as six months, depending on project requirements.
Key details include:
Power capacity: 2 MW, 2.25 MW, and 2.5 MW configurations.
Power technology: Galaxy VXL UPS technology.
Target environments: Hyperscale, neocloud, and colocation data centers.
Reference-design alignment: Support for NVIDIA GB300 NVL72 infrastructure designs with integrated power-management and liquid-cooling controls.
Manufacturing location: Sant Boi de Llobregat, Barcelona, Spain.
The announcement reflects the increasing need to coordinate electrical power, cooling, and physical infrastructure as AI workloads drive higher rack densities and larger data center deployments.
Related ARC Insights
ARC has examined the related changes in AI data center power, cooling, reference architectures, and deployment models. The following articles provide additional context on the infrastructure requirements associated with high-density AI computing.
Schneider Electric and Foxconn Collaborate on AI Data Center Infrastructure
Schneider Electric, NVIDIA Co-Engineer GB300 NVL72 Power and Cooling Frameworks
Together, these developments show that AI data center design is increasingly being addressed through pre-engineered systems that combine power distribution, cooling, and reference architectures rather than through separately specified infrastructure components.