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Schneider Electric and Foxconn announced a strategic collaboration to develop integrated, ready-to-deploy infrastructure solutions for next-generation AI data centers.
Schneider Electric announced a strategic collaboration with Hon Hai Technology Group, also known as Foxconn, to help define and scale next-generation AI data centers. As AI adoption increases, digital infrastructure requirements are growing and changing very rapidly. The collaboration brings together Foxconn’s capabilities in advanced compute platforms, AI rack integration, and global manufacturing with Schneider Electric’s capabilities in power systems, cooling, and energy management.
Together, the strategic collaboration will enable Schneider Electric and Foxxcon to deliver integrated, ready-to-deploy solutions that help customers build and operate AI infrastructure with greater speed, efficiency, and predictability across regions. Production is expected to begin later this year.
Through the collaboration, Schneider Electric and Foxconn will co-develop next-generation reference architectures for AI data centers. The companies will also explore areas including:
Closed-loop energy optimization
Modular power and cooling skids
Standardized design frameworks
Repeatable deployment blueprints for AI data center infrastructure
The collaboration is intended to help support scalable AI infrastructure by aligning compute manufacturing, power systems, cooling, and energy management capabilities. This approach can help customers address the rapidly growing infrastructure requirements associated with AI workloads and large-scale data center deployment.
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