ZEDEDA and Ambarella Partner to Bring Cloud-Orchestrated AI to Billions of Devices at the Physical Edge
ZEDEDA and Ambarella are connecting edge AI silicon and cloud orchestration to simplify secure, fleet-scale physical AI deployments.
IFS Softeon Brings Industrial AI Deeper Into Warehouse Execution
The IFS-Softeon combination illustrates how Industrial AI could move from supply chain analytics into warehouse execution.
Space Cargo Unlimited and SpaceX Advance Commercial In-Space Manufacturing
Space Cargo Unlimited’s Starfall mission with SpaceX supports the scale-up of commercial manufacturing in microgravity.
Palladyne AI and FANUC America Partner to Expand the Reach of Intelligent Robotic Automation
Palladyne AI and FANUC America are combining physical AI software and industrial robotics to support more adaptable and easier-to-deploy automation.
Industry Groups Unite to Accelerate Single Pair Ethernet Adoption
The Single Pair Ethernet System Alliance and SPE Industrial Partner Network have merged to form the Single Pair Ethernet Association, bringing together more than 130 companies to advance SPE standardization, implementation, and adoption.
NVIDIA Is Buying the Distribution Layer of AI
NVIDIA’s move for Hugging Face highlights how AI competition is shifting from individual components toward the platforms that connect models, developers, applications, and infrastructure
Open Secure AI Alliance Finds a Neutral Home at the Linux Foundation
The Open Secure AI Alliance has moved to the Linux Foundation, establishing neutral governance for collaborative development of open AI security technologies.
Yokogawa Signs Distribution Agreement with BuyCo for its Container Transport Management SaaS
Yokogawa has signed a distribution agreement with BuyCo to offer its container transportation management SaaS to companies, particularly in the materials industry.
Hitachi Digital Services and adesso Strengthen Partnership for Industrial Digital Transformation
Hitachi Digital Services and adesso are expanding their partnership to combine cloud transformation, AI-enabled engineering, and application reliability services for asset-intensive industries.
GE Vernova and LS ELECTRIC Establish VSC-HVDC Joint Venture
GE Vernova and LS ELECTRIC are forming a Joint venture, Grid X Technology, to combine VSC-HVDC technology, manufacturing, and project execution capabilities for Korea’s transmission market.