CHIPS for America Releases Vision for $3 Billion Semiconductor Manufacturing Program

Author photo: Patrick Arnold
ByPatrick Arnold
Category:
Company and Product News

The United States has announced its plan to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors. The National Institute of Standards and Technology (NIST) has laid out how the U.S. will benefit from the CHIPS for America program’s manufacturing incentives and research and development efforts. Approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in semiconductor manufacturing.

In response to the growing importance of semiconductors in various industries, the impact of supply chain disruptions in recent years, and future trade uncertainty with major chip supplier Taiwan, there has been a regulatory push for increasing the resilience of domestic semiconductor manufacturing. The U.S. government has shown interest in supporting the industry through regulatory actions and funding initiatives to boost semiconductor research, development, and manufacturing capabilities. CHIPS for America is part of the United States’ plan to stimulate private sector investment, increase domestic manufacturing capacity, and enhance semiconductor R&D initiatives.

CHIPS for America Outlines the Vision

To outline the vision, CHIPS for America published “The Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), which details the plan, mission and objectives for the advanced packaging program created by the CHIPS and Science Act CHIPS for Americaof 2022. The NAPMP is one of four CHIPS for America R&D programs that together are establishing the innovation ecosystem needed to ensure that American semiconductor fabrication facilities produce sophisticated and cutting-edge technologies.

Advanced packaging is a design and manufacturing method that places multiple chips with various functions in a densely interconnected “package.” This design paradigm can help the sector achieve the increasingly compact dimensions that the most advanced semiconductors require. Advanced packaging requires an interdisciplinary approach that brings together chip designers, materials scientists, process and mechanical engineers, measurement scientists, and others. Currently, the United States is limited in both conventional and advanced packaging capacity.

Developing these advanced packaging capabilities in the United States is a key step in furthering the country’s technological leadership and economic security. The CHIPS for America R&D programs will support the development of advanced packaging technology in the United States that can be deployed to manufacturing facilities, including recipients of CHIPS manufacturing incentives.

Read the full vision document on the NIST website.

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