Featured here are original and timely articles from ARC analysts and guest writers on topics such as Digitization, New Business Models, Internet of Things, Industry 4.0, Smart Cities, and Smart Manufacturing. We dive into technologies such as additive manufacturing, machine learning, asset performance management, device connectivity, IIoT architecture, cybersecurity, augmented reality, and more related to digitization and transformation of industries, infrastructure, and cities. Our goal is to provide readers with clear and concise analyses, opinions, and discussion of these trends, technologies, and services.
Earlier this month, I had the chance to attend HP’s analyst event and Labelexpo Europe 2025 in Barcelona. Both events made one thing very clear: the world of labels and packaging is changing faster than ever.